CVE-2017-18314

CVE-2017-18314 affects Qualcomm closed‑source components. The entry notes that on TZ cold boot the CNOC_QDSS RG0, which is locked by xBL_SEC, is cleared by TZ. This is categorized as a Critical issue in the Qualcomm closed‑source component list and is referenced in Android/industry bulletins. The...

CVE-2017-18280

CVE-2017-18280 : In Snapdragon platforms (Automobile, Mobile, Wear) across listed SoCs, a trusted application that has opened an SPI/I2C interface to a device could allow another trusted application to read data via the SPI/I2C read function. The initial disclosures list the affected families (e....

CVE-2017-18301

CVE-2017-18301 concerns Qualcomm/ Snapdragon components used in Small Cell SoC and Snapdragon devices (Automobile, Mobile, Wear) including FSM9055, FSM9955, MDM9607, MDM9640, MDM9650, MSM8909W, SD 425/427/430/435/450, SD 617/625/650/52, SD 820/820A, SD 835, SD 845, SDM630/636/660, SDX20, Snapdrag...

CVE-2018-11267

Technical details about CVE-2018-11267 are not publicly available in the provided connected documents. The entry lists affected Qualcomm/SD components but does not specify root cause, vulnerable versions, impact specifics, or remediation. Monitor for updates.

CVE-2018-11277

The CVE-2018-11277 issue affects Snapdragon devices (Automobile, Mobile, Wear) with listed MSM/SD platforms where the vendor package com.qualcomm.embms is deployed in the system image and has an inadequate permission level. This allows any app installed from the Play Store to request this permiss...

CVE-2018-11982

CVE-2018-11982 affects Snapdragon platforms (Mobile/Wear) including MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/212/205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_M...